Sample Solution: Wireless FIF System
Partnering with Telect for configured connectivity solutions offers significant cost and time savings. Users gain the simplicity of one point of contact and one purchase order with multi-vendor solutions.
The Application:
Cross-connect point between local LEC facilities and a wireless provider's base transceiver station (BTS). Requirements include E911 LMUs, T1 and T3 connectivity, system integrated access devices, and power distribution.
The Solution:
Telect Systems Integration team engineered a standardized facility interface frame (FIF) solution that included equipment from other OEMs and Telect connectivity products. Utilizing modular DSX systems, Telect enabled DSX-1 and DSX-3 connectivity in a single chassis to meet varying requirements.
The Project:
In a standard 7-foot rack, Telect installed a dual-feed 100A 20-position fuse panel that operates at +24V or -48V on either bus simultaneously, allowing operation in a variety of markets. The fuse panel is pre-wired with a 16 AWG-laced harness,
enabling the quick installation of customer-supplied equipment. Standard 4000 Series modular DSX chassis included 32 DSX-1 circuits loaded, with expansion capabilities up to 84 terminations. Five pre-wired cross-connect circuits, a ground bar and fuses were included.
Additional Solutions:
- High-density DSX-1 bays, including the industry-leading XD Bay
- Startup and expansion DSX-3 bays featuring innovative Telect systems like the BCS II
- Fiber optic distribution bays, with bulkhead-style or tray-based panels
- Cabinetized solutions for additional security
- All cabling, cable management and accessories as required
Get a project started with Telect. Click here to email the Systems Integration team.
